Custom 2.4GHz WiFi & Bluetooth Internal Antenna Pigtail (IPEX / U.FL / Solder Type)
Custom 2.4GHz WiFi & Bluetooth Internal Antenna Pigtail (IPEX / U.FL / Solder Type) - Image 2
Custom 2.4GHz WiFi & Bluetooth Internal Antenna Pigtail (IPEX / U.FL / Solder Type) - Image 3

Custom 2.4GHz WiFi & Bluetooth Internal Antenna Pigtail (IPEX / U.FL / Solder Type)

  • Frequency Range: 2400 – 2500 MHz (2.4G WiFi / Bluetooth)

  • Connector Options: IPEX MHF1 (1st Gen), IPEX MHF4 (4th Gen), MMCX, SMA, or Stripped/Tinned

  • Cable Standard: RF113 (1.13mm Micro Coaxial Cable)

  • Performance: 1dBi Gain, 50Ω Impedance, VSWR ≤ 1.5

  • Compliance: 100% RoHS, SGS, and CTI certified materials (including lead-free solder)

  • Applications: IoT devices, UAVs (drones), laptops, smart home routers, RC models

  • MOQ / Lead Time: Low MOQ, fast prototyping, 7–15 days (project-based)

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  • Fully Certified Eco-Friendly Materials: We guarantee that every component of this antenna assembly—from the RF113 coaxial wire and IPEX connectors to the lead-free solder tin—has passed strict environmental testing by SGS and CTI (RoHS compliant). This ensures smooth customs clearance and compliance for your devices entering European and North American markets.

  • Versatile IPEX & Soldering Options: We provide terminations to fit any PCB profile. Choose IPEX 1st Gen (U.FL equivalent) for standard modules, IPEX 4th Gen (MHF4 equivalent) for ultra-low-profile compact devices, or Stripped and Tinned ends for direct, secure soldering onto your motherboard.

  • Optimized RF Signal Performance: Engineered for high-sensitivity wireless communication. With a stable 50-ohm impedance and a low VSWR of ≤1.5, these internal antennas prevent signal reflection and maximize the transmission range of your 2.4G routers, Bluetooth IoT sensors, and drone flight controllers.

  • Custom Lengths & Aesthetics: Available in classic Gray, Black, and White jackets to match your internal routing aesthetics. We cut and assemble the RF113 cable to your exact millimeter specifications to prevent excess wire buildup inside compact device housings.

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